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Samsung Electronics Co., Ltd. and Western Digital announced a memorandum of understanding (MOU) for a unique collaboration to standardize and accelerate the adoption of next-generation data placement, processing, and fabrics (D2PF) storage technologies. The companies will initially concentrate their efforts on aligning their efforts and developing a robust ecosystem for Zoned Storage solutions. These steps will allow the industry to focus on a plethora of applications that will ultimately create more value for customers.