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The first question arises that why X-ray Inspection for BGA? It is well known that the BGA (Ball Grid Arrays) rework and repair needs a microscopic eye for inspection or to make corrections. BEST offers real-time x-ray technology to evaluate solder joint integrity for BGAs and other leadless packages that cannot be inspected by conventional vision systems. This detection can only be possible with x-ray inspection. To know more details read this blog...